| 1. | J.O.G. Parent, D.D.L. Chung and I.M. Bernstein, "Effects of Intermetallic Formation at the Interface between Copper and Tin-Lead Solder", J. Mater. Sci. 23, 2564-2572 (1988). |
| 2. | Mingguang Zhu and D.D.L. Chung, "Active Brazing Alloy Paste as a Totally Metal Thick Film Conductor Material", J. Electron. Mater. 23(6), 541-549 (1994). |
| 3. | D.D.L. Chung, "Electrical Behavior of Solids", J. Educational Modules for Mat. Sci. Eng. 2, 747 (1980). |
| 4. | Mingguang Zhu and D.D.L. Chung, "On the Simultaneous Calcination and Sintering of YBa2Cu3O7-x in High -Magnetic Fields", Mater. Lett. 18, 186-190 (1994). |
| 5. | Shoukai Wang and D.D.L. Chung, "Self-Monitoring of Strain in Silicon Carbide Whisker Reinforced Silicon Nitride", Smart Mater. Struct. 6, 199-203 (1997). |
| 6. | Xiangcheng Luo and D.D.L. Chung, "A Comparative Study of Silver-Epoxy and Tin-Lead Solder in Their Joints with Copper, through Mechanical and Electrical Measurements During Debonding", J. Mater. Sci. 34, 273-276 (1999). |
| 7. | Jian Wang and D.D.L. Chung, "A Comparative Study of the Vibration Damping Capacity of Superalloys", J. Mater. Eng. Perf. 8, 577-578 (1999). |
| 8. | Xiangcheng Luo and D.D.L. Chung, "Interface in Mechanically Fastened Steel Joint, Studied by Contact Electrical Resistance Measurement", J. Mater. Eng. Perf. 9(1), 95-97 (2000). |
| 9. | Yunsheng Xu, Xiangcheng Luo and D.D.L. Chung, "Sodium Silicate Based Thermal Pastes for High Thermal Contact Conductance", J. Electron. Packaging 122(2), 128-131 (2000). |
| 10. | D.D.L. Chung, "Materials for Electromagnetic Interference Shielding", J. Mater. Eng. Perf. 9(3), 350-354 (2000). |
| 11. | Xiangcheng Luo and D.D.L. Chung, "Material Contacts under Cyclic Compression, Studied in Real Time by Electrical Reistance Measurement", J. Mater. Sci. 35(19), 4795-4802 (2000). |
| 12. | Xiangcheng Luo and D.D.L. Chung, "Degradation of Mechanically Fastened Stainless Steel Joint During Repeated Fastening and Unfastening", Adv. Eng. Mater. 3(1-2), 62-65 (2001). |
| 13. | Zongrong Liu and D.D.L. Chung, "Development of Glass-Free Metal Electrically Conductive Thick Films", J. Electron. Packaging 123(1), 64-69 (2001). |
| 14. | D.D.L. Chung, "Thermal Interface Materials", J. Mater. Eng. Perf. 10(1), 56-59 (2001). |
| 15. | D.D.L. Chung, "Materials for Thermal Conduction", Appl. Thermal Eng. 21(ER16), 1593-1605 (2001). |
| 16. | D.D.L. Chung, "Joints Obtained by Soldering, Adhesion, Autohesion and Fastening, Studied by Electrical Resistance Measurement", J. Mater. Sci. 36(11), 2591-2596 (2001). |
| 17. | Xiangcheng Luo, Yunsheng Xu and D.D.L. Chung, "Thermal Stability of Thermal Interface Pastes Evaluated by Thermal Contact Conductance Measurement", J. Electron. Packaging 123(3), 309-311 (2001). |
| 18. | Taejin Kim and D.D.L. Chung, "Effect of Stress on the Electrical Resistivity of Solder", J. Electron. Mater. 30(10), L29-L31 (2001). |
| 19. | Wenhai Fu and D.D.L. Chung, "Vibration Reduction Ability of Polymers, Particularly Polymethylmethacrylate and Polytetrafluoroethylene", Polym. Polym. Compos. 9(6), 423-426 (2001). |
| 20. | Zongrong Liu and D.D.L. Chung, "Low Temperature Air-Fireable Glass-Free Metallic Thick Film Electrical Conductor Materials", J. Electron. Mater. 11(30), 1458-1465 (2001). |
| 21. | Xiangcheng Luo and D.D.L. Chung, "Effect of the Thickness of a Thermal Interface Material (Solder) on Heat Transfer Between Copper Surfaces", Int. J. Microcircuits Electronic Packaging 24(2), 141-147 (2001). |
| 22. | D.D.L. Chung, "Materials for Vibration Damping", J. Mater. Sci. 36(24), 5733-5737 (2001). |
| 23. | J.A. Fernando and D.D.L. Chung, "Pore Structure and Permeability of an Alumina Fiber Filter Membrane for Hot Gas Filtration", J. Porous Mater., 9(3),211-219(2002). |
| 24. | J.A. Fernando and D.D.L. Chung, "Improving an Alumina Fiber Filter Membrane for Hot Gas Filtration using an Acid Phosphate Binder", J. Mater. Sci. 36(21), 5079-5085 (2001). |
| 25. | D.D.L. Chung, "Intrinsically Smart Structural Composites", Materials Today Jan. 2002, p. 30-35. |
| 26. | Xiangcheng Luo and D.D.L. Chung, "Irreversible Structural Change at the Interface Between Components During Fastening", Fastener Tech. Int. 25(1), 86-87 (2002). |
| 27. | Taejin Kim and D.D.L. Chung,"Thermoelectric Behavior of Solder", J. Electron. Packaging 125(1), 161-162 (2003). |
| 28. | Kyu-Dong Kim and D.D.L. Chung, "Effect of Heating on the Electrical Resistivity of Conductive Adhesive and Soldered Joints", J. Electron. Mater. 31(9), 933-939 (2002). |
| 29. | Matthew Poeller and D.D.L. Chung, "Effect of Heating on the Structure of an Adhesive Joint, as Indicated by Electrical Resistance Measurement", J. Adhesion 79(6), 549-558 (2003). |
| 30. | Sihai Wen and D.D.L. Chung, "Effect of Stress on the Dielectric Constant of Alumina", J. Electron. Packaging, 127(3), 235-236 (2005) |
| 31. | Shoukai Wang and D.D.L. Chung, "Piezoresistivity in Silicon Carbide Fibers", J. Electroceramics 10, 147-152 (2003). |
| 32. | Zongrong Liu and D.D.L. Chung, "Comparative Study of Electrically Conductive Thick Films With and Without Glass", J. Electron. Mater. 33(3), 194-202 (2004). |
| 33. | Sihai Wen and D.D.L. Chung, "Effect of Stress on the Dielectric Constant of Alumina", J. Electron. Packaging127, 235-236 (2005). |
| 34. | J.A. Fernando and D.D.L. Chung, "Thermomechanical Properties of Alumina Fiber Membrane", Ceramics Int.31(3), 453-460 (2005). |
| 35. | Zongrong Liu and D.D.L. Chung, "Burnout of the Organic Vehicle in an Electrically Conductive Thick-Film Paste", J. Electron. Mater. 33(11), 1316-1325 (2004). |
| 36. | Zongrong Liu and D.D.L. Chung, "Effect of Firing Atmosphere on Air-Fireable Glass-Free Electrically Conductive Thick Film", J. Electron. Mater. 34(3), 287-293 (2005). |
| 37. | Kyu Dong Kim and D.D.L. Chung, "Electrically-Conductive Adhesive and Soldered Joints under Compression", J. Adh. Sci. Tech. 19(11), 1003-1023 (2005). |
| 38. | Junhua Wu and D.D.L. Chung, "Pastes for Electromagnetic Interference Shielding", J. Electron. Mater.34(9), 1255-1258 (2005). |
| 39. | Taejin Kim and D.D.L. Chung, "Mats and Fabrics for Electromagnetic Interference Shielding", J. Mater. Eng. Perf., 15, 295-298 (2006) |
| 40. | D.D.L. Chung, "Advances in Thermal Interface Materials", Advancing Microelectronics, 33(4), 8-11 (2006). |
| 41. | Yu-Cheng Liu, Yasuhiro Aoyagi and D.D.L. Chung, "Development of Epoxy-Based Electrets", J. Mater. Sci., 43(5), 1650-1663 (2008). |
| 42. | D.D.L. Chung, "Comment on Piezoresistive Effect
in SiOC Ceramics for Integrated Pressure Sensors", J. Am. Ceramic Soc., 94(1),
289 (2011). |
| 43. | Yong Fu and D.D.L. Chung,"Coagulation of Oil in Water Using Sawdust, Bentonite and Calcium Hydroxide to Form Floatable Sheets", Appl. Clay Science 53, 634-641 (2011). |
| 44. | Tianlei Sun and D.D.L. Chung,"Coagulation of Oil in Water Using Sawdust and Bentonite and the Formation of a Floating Coagulated Material", J. Environmental Engineering 139, 1470-1481 (2013). |
| 45. | Qiaoli Meng, Yibadan Kenayeti and D.D.L. Chung,"Battery in the form of a soil-matrix composite", J. Energy Engineering online publication (2012). |
| 46. | Shuang Lu and D.D.L. Chung,"Viscoelastic behavior of silica particle compacts under dynamic compression", ASCE Journal of Materials in Civil Engineering 26(3), 551-553 (2014). |
| 47. | Shuang Lu and D.D.L. Chung,"Viscoelastic behavior of silica fume in the absence of a binder", ACI Materials J. 111(1-6), 1-10 (2014) |
| 48. | Shuang Lu and D.D.L. Chung,"Effect of organic intercalation on the viscoelastic behavior of clay", J. Mater. Sci.49(8), 3189-3195. |
| 49. | Yoshihiro Takizawa, and D.D.L. Chung "Fumed-alumina-derived nanoporous alumina as a new low-k dielectric material for microelectronic packaging" J. Electronic Mater.44(7), 2211-2220(2015) |
| 50. | Xinghua Hong, Daojun Wang and D.D.L. Chung "Boron nitride nanotube mat as a low-k dielectric material with relative dielectric constant ranging from 1.0 to 1.1" J. Electronic Mater.45(1), 453-461 (2016) |
| 51. | Xinghua Hong, Daojun Wang and D.D.L. Chung "Strong Viscous Behavior Discovered in Nanotube Mats, as Observed in Boron Nitride Nanotube Mats" Composites.Part B, B91, 56-64 (2016) |
| 52. |
D.D.L. Chung, “
"Mildred S. Dresselhaus (1930-2017)", Nature 543, 316 (2017).
|
| 53. |
D.D.L. Chung, “
Mauricio Terrones, Katsumi Kaneko, Peter Thrower, Morinobu Endo, Hui-Ming Cheng, Michael Strano. Mildred S. Dresselhaus (1930 – 2017) – A Tribute from the Carbon Journal. Carbon 119, 573-577 (2017).
|
| 54. |
D.D.L. Chung and Kairong Shi, “
Sensing the stress in steel by capacitance measurement, Sensors and Actuators A 274, 244-251 (2018).
|