1. |
Mingguang Zhu and D.D.L. Chung, "Resilient Composite of Silicone and Foamed
Tin as a New Material for Electrical Contacts and Thermal Contacts", Composites 22(3), 219-226
(1991).
|
2. |
Lin Li and D.D.L. Chung, "Electrically
Conducting Powder Filled Polyimidesiloxane", Composites 22(3), 211-218 (1991).
|
3. |
Mingguang Zhu and D.D.L. Chung, "Nickel Fiber Silicone-Matrix Composites as
Resilient Electrical Conductors", J. Electron. Packaging 113, 417-420 (1991).
|
4. |
Mingguang Zhu and D.D.L. Chung, "A Three-Dimensionally Interconnected Metal
Spring Network in a Silicone Matrix as a Resilient and Electrically Conducting Composite Material", Composites
23(5), 355-364 (1992).
|
5. |
Lin Li and D.D.L. Chung, "Electrical and Mechanical Properties of
Electrically Conductive Polyethersulfone Composite", Composites 25(3), 215-224 (1994).
|
6. |
Lin Li, Pay Yih and D.D.L. Chung, "Effect of the Second Filler Which Melted
During Composite Fabrication on the Electrical Properties of Short Fiber Polymer-Matrix Composites", J.
Electron. Mater. 21(11), 1065-1071 (1992).
|
7. |
Mingguang Zhu and D.D.L. Chung, "Resilient Metal Spring Network
Silicone-Matrix Composite for Separable Interconnections", J. Electron. Mater. 23(7), 641-647
(1994).
|
8. |
Lin Li and D.D.L. Chung, "Tin-Lead Flake Polyether Sulfone Composite Formed by In-Situ Melt
Processing of Tin-Lead Particles", Polym. Compos. 14(5), 361-366 (1993).
|
9. |
Lin Li and D.D.L. Chung, "Effect of Viscosity on the Electrical Properties
of Conducting Thermoplastic Composites Made by Compression Molding of a Powder Mixture", Polym.
Compos. 14(6), 467-472 (1993).
|
10. |
Lin Li and D.D.L. Chung, "Thermally Conducting Polymer-Matrix Composites Containing both AlN
Particles and SiC Whiskers", J. Electron. Mater. 23(6), 557-564 (1994).
|
11. |
Xiaoping Shui and D.D.L. Chung, "Submicron Nickel Filaments Made by
Electroplating Carbon Filaments as a New Filler Material for Electromagnetic Interference Shielding",
J. Electron. Mater. 24(2), 107-113 (1995).
|
12. |
Xiaojun Wang and D.D.L. Chung, "Short Carbon
Fiber Reinforced Epoxy as a Piezoresistive Strain Sensor", Smart Mater. Struct. 4, 363-367
(1995).
|
13. |
Xiaojun Wang and D.D.L. Chung, "Continuous Carbon Fiber Epoxy-Matrix
Composite as a Sensor of Its Own Strain", Smart Mater. Struct. 5, 796-800 (1996).
|
14. |
Xiaoping Shui and D.D.L. Chung, "Piezoresistive Carbon Filament
Polymer-Matrix Composite Strain Sensor", Smart Mater. Struct. 5, 243-246 (1996).
|
15. |
Steven W. Hudnut and D.D.L. Chung, "Use
of Submicron Diameter Carbon Filaments for Reinforcement between Continuous Carbon Fiber Layers in a
Polymer-Matrix Composite", Carbon 33(11), 1627-1631 (1995).
|
16. |
Steven W. Hudnut and D.D.L. Chung, "Enhancing the Loss Modulus of Carbon
Fiber Polymer-Matrix Composites by Addition of Particles in the Interlaminar Region", Rubber and
Composites Processing and Applications 25(2), 77-81 (1996).
|
17. |
Xiaoping Shui and D.D.L. Chung, "Nickel Filament Polymer-Matrix Composites
with Low Surface Impedance and High Electromagnetic Interference Shielding Effectiveness", J.
Electron. Mater. 26(8), 928-934 (1997).
|
18. |
Xiaoping Shui and D.D.L. Chung, "Magnetic Properties of Nickel Filament
Polymer-Matrix Composites", J. Electron. Mater. 25(6), 930-934 (1996).
|
19. |
Xiaoping Shui and D.D.L. Chung, "A New Electromechanical Effect in
Discontinuous-Filament Elastomer-Matrix Composites", Smart Mater. Struct. 6, 102-105 (1997).
|
20. |
Lin Li and D.D.L. Chung, "Z-Axis Anisotropic Electrically Conducting
Polymer-Matrix Composite Film", J. Electron. Packaging 119(4), 255-259 (1997).
|
21. |
Xiaoping Shui and D.D.L. Chung, "0.4 mm Diameter Nickel Filament Silicone-Matrix
Resilient Composites for Electromagnetic Interference Shielding", J. Electron. Packaging 119(4),
236-238 (1997).
|
22. |
Xiaojun Wang and D.D.L. Chung, "Real-Time Monitoring of Fatigue Damage and
Dynamic Strain in Carbon Fiber Polymer-Matrix Composite by Electrical Resistance Measurment", Smart
Mater. Struct. 6, 504-508 (1997).
|
23. |
Xiaojun Wang and D.D.L. Chung, "Sensing Delamination in a Carbon Fiber
Polymer-Matrix Composite During Fatigue by Electrical Resistance Measurement", Polym. Compos.
18(6), 692-700 (1997).
|
24. |
Xiaojun Wang and D.D.L. Chung, "Self-Monitoring of Fatigue Damage and Dynamic Strain in Carbon Fiber
Polymer-Matrix Composite", Composites: Part B, 29B(1), 63-73 (1998).
|
25. |
Xiaojun Wang and D.D.L. Chung, "An Electromechanical Study of the Transverse
Behavior of Carbon Fiber Polymer-Matrix Composite", Composite Interfaces 5(3), 191-199 (1998).
|
26. |
Xiaojun Wang and D.D.L. Chung, "Residual Stress in Carbon Fiber Embedded in
Epoxy, Studied by Simultaneous Measurement of Applied Stress and Electrical Resistance", Composite
Interfaces 5(3), 277-281 (1998).
|
27. |
Xiaojun Wang and D.D.L. Chung, "Electromechanical Study of Carbon Fiber
Composites", J. Mater. Res. 13(11), 3081-3092 (1998).
|
28. |
Xiaojun Wang and D.D.L. Chung, "Short Carbon Fiber Reinforced Epoxy Coating as a Piezoresistive Strain
Sensor for Cement Mortar", Sensors and Actuators A 71(3), 208-212 (1998).
|
29. |
Zhen Mei and D.D.L. Chung, "Effect of Heating on the Structure of Carbon
Fiber Polyphenylenesulfide-Matrix Composite, as Studied by Electrical Resistance Measurement", Polym.
Compos. 19(6), 709-713 (1998).
|
30. |
Shoukai Wang and D.D.L. Chung, "Interlaminar Shear in Carbon Fiber
Polymer-Matrix Composites, Studied by Measuring the Contact Electrical Resistance of the Interlaminar
Interface During Shear", Composite Interfaces 6(6), 507-518 (1999).
|
31. |
D.D.L. Chung and Shoukai Wang, "Carbon Fiber Polymer-Matrix Structural
Composite as a Semiconductor and Concept of Optoelectronic and Electronic Devices Made From It", Smart
Mater. Struct. 8, 161-166 (1999).
|
32. |
Shoukai Wang and D.D.L. Chung, "Interlaminar Interface in Carbon Fiber
Polymer-Matrix Composites, Studied by Contact Electrical Resistivity Measurement", Composite
Interfaces 6(6), 497-506 (1999).
|
33. |
Xiaojun Wang, Shoukai Wang and D.D.L. Chung, "Sensing Damage in Carbon Fiber
and Its Polymer-Matrix and Carbon-Matrix Composites by Electrical Resistance Measurement", J. Mater.
Sci. 24(11), 2703-2714 (1999).
|
34. |
Shoukai Wang and D.D.L. Chung, "Carbon Fiber Polymer-Matrix Composite
Interfaces as Thermocouple Junctions", Composite Interfaces 6(6), 519-530 (1999).
|
35. |
Yunsheng Xu and D.D.L. Chung, "Z-Axis Anisotropic Electrical Conductor Films
in Adhesive and Standalone Forms for Electrical Interconnections", J. Electron. Mater. 28(11),
1307-1313 (1999).
|
36. |
Zhen Mei and D.D.L. Chung, "Kinetics of Autohesion of Thermoplastic
Carbon-Fiber Prepregs", Int. J. Adh. Adh. 20(2), 173-175 (2000).
|
37. |
Shoukai Wang and D.D.L. Chung, "Apparent Negative Electrical Resistance in Carbon Fiber Composites",
Composites: Part B, 30(6), 579-590 (1999).
|
38. |
Shoukai Wang and D.D.L. Chung, "Electrical Behavior of Carbon Fiber
Polymer-Matrix Composites in the Through-Thickness Direction", J. Mater. Sci. 35(1), 91-100
(2000).
|
39. |
Martin Segiet and D.D.L. Chung, "Discontinuous Surface-Treated
Submicron-Diameter Carbon Filaments as an Interlaminar Filler in Carbon Fiber Polymer-Matrix Composites for
Vibration Reduction", Composite Interfaces 7(4), 257-276 (2000).
|
40. |
Shoukai Wang and D.D.L. Chung, "Temperature/Light Sensing Using Carbon Fiber Polymer-Matrix Composite",
Composites: Part B, 30(6), 591-601 (1999).
|
41. |
Zhen Mei and D.D.L. Chung, "Thermal Stress Induced Thermoplastic Composite
Debonding, Studied by Contact Electrical Resistance Measurement", Int. J. Adh. Adh. 20(2),
135-139 (2000).
|
42. |
Xiaojun Wang and D.D.L. Chung, "Fiber Breakage in Polymer-Matrix Composite
During Static and Dynamic Loading, Studied by Electrical Resistance Measurement", J. Mater. Res.
14(11), 4224-4229 (1999).
|
43. |
Zhen Mei and D.D.L. Chung, "Effect of Heating Time Below the Melting Temperature on Polyphenylene
Sulfide Joint Development", Int. J. Adh. Adh. 20(4), 273-277 (2000).
|
44. |
Xiaoping Shui and D.D.L. Chung, "Submicron Diameter Nickel Filaments and
Their Polymer-Matrix Composites", J. Mater. Sci. 35, 1773-1785 (2000).
|
45. |
Yunsheng Xu and D.D.L. Chung, "Increasing the Thermal Conductivity of Boron
Nitride and Aluminum Nitride Particle Epoxy-Matrix Composites by Particle Surface Treatment", Composite
Interfaces 7(4), 243-256 (2000).
|
46. |
Xiangcheng Luo and D.D.L. Chung, "Carbon Fiber Polymer-Matrix Composites as
Capacitors", Compos. Sci. Tech. 61(5), 885-888 (2001).
|
47. |
Shoukai Wang and D.D.L. Chung, "Piezoresistivity in Continuous Carbon Fiber
Polymer-Matrix Composite", Polym. Compos. 21(1), 13-19 (2000).
|
48. |
Zhen Mei and D.D.L. Chung, "Glass Transition and Melting Behavior of Carbon Fiber Reinforced
Thermoplastic Composite, Studied by Electrical Resistance Measurement", Polym. Compos. 21(5),
711-715 (2000).
|
49. |
Shoukai Wang and D.D.L. Chung, "Consolidation of Carbon Fiber Laminae During
Polymer-Matrix Composite Fabrication, Studied by Electrical Resistance Measurement", Polym.
Compos. 22(1), 42-46 (2001).
|
50. |
Xiangcheng Luo and D.D.L. Chung, "Interface in Mechanically Fastened Polymer
Joint, Studied by Contact Electrical Resistance Measurement", Polym. Eng. Sci. 40(7), 1505-1509
(2000).
|
51. |
D.D.L. Chung, "Polymer-Matrix
Composites for Microelectronics", Polym. Polym. Compos. 8(4), 219-229 (2000).
|
52. |
Zhen Mei and D.D.L. Chung, "Cold-Crystallization of Polyphenylene Sulfide,
Studied by Measuring the Electrical Resistance of a Carbon-Fiber Polyphenylene-Sulfide-Matrix Composite",
Polym. Polym. Compos. 8(5), 319-324 (2000).
|
53. |
D.D.L. Chung, "Continuous
Carbon Fiber Polymer-Matrix Composites and Their Joints, Studied by Electrical Measurements", Polym.
Compos. 22(2), 250-270 (2001).
|
54. |
D.D.L. Chung, "Thermal Analysis of Carbon Fiber Polymer-Matrix Composites by
Electrical Resistance Measurement", Thermochim. Acta 364(1-2), 121-132 (2000).
|
55. |
Zongrong Liu and D.D.L. Chung, "Calorimetric Evaluation of Phase Change Materials for Use as Thermal
Interface Materials", Thermochim. Acta 366(2), 135-147 (2001).
|
56. |
Zhen Mei and D.D.L. Chung, "Thermal History of Carbon Fiber Polymer-Matrix
Composite, Evaluated by Electrical Resistance Measurement", Thermochim. Acta 369(2), 135-147
(2001).
|
57. |
Shoukai Wang and D.D.L. Chung, "Thermal Fatigue in Carbon Fiber
Polymer-Matrix Composite, Monitored in Real Time by Electrical Resistance Measurement", Polym. Polym.
Compos. 9(2), 135-140 (2001).
|
58. |
Zhen Mei and D.D.L. Chung, "Improving the Flexural Modulus and Thermal
Stability of Pitch by the Addition of Silica Fume", J. Reinf. Plastics Compos. 21(1), 91-95
(2002).
|
59. |
Yunsheng Xu, D.D.L. Chung and Cathleen Mroz, "Thermally
Conducting Aluminum Nitride Polymer-Matrix Composites", Composites: Part A, 32(12), 1749-1757
(2001).
|
60. |
Shoukai Wang, Sang-il Lee, D.D.L. Chung and Joung-Man Park, "Load Transfer from
Fiber to Polymer Matrix, Studied by Measuring the Apparent Elastic Modulus of Carbon Fiber Embedded in
Epoxy", Compos. Interfaces Lett. 8(6), 435-441 (2001).
|
61. |
Shoukai Wang and D.D.L. Chung, "Mechanical Damage in Carbon Fiber
Polymer-Matrix Composite, Studied by Electrical Resistance Measurement", Composite Interfaces
9(1), 51-60 (2002).
|
62. |
Shoukai Wang, Zhen Mei and D.D.L. Chung, "Interlaminar
Damage in Carbon Fiber Polymer-Matrix Composites, Studied by Electrical Resistance Measurement", Int.
J. Adh. Adh. 21(ER6), 465-471 (2001).
|
63. |
D.D.L. Chung, "Thermal Analysis by Electrical Resistivity Measurement",
J. Thermal Analysis and Calorimetry 65, 153-165 (2001).
|
64. |
Yunsheng Xu, Xiangcheng Luo and D.D.L. Chung, "Lithium Doped Polyethylene-Glycol-Based Thermal Interface Pastes for High
Thermal Contact Conductance", J. Electron. Packaging 124(3), 188-191 (2002).
|
65. |
Daniel P. Kowalik and D.D.L. Chung, "Carbon Black Filled Silicone as a
Compliant Thermoelectric Material", J. Reinf. Plastics Compos. 21(17), 1587-1590 (2002).
|
66. |
Zhen Mei, Victor H. Guerrero, Daniel P. Kowalik and D.D.L. Chung, "Reverse
Piezoelectric Behavior of Carbon Fiber Thermoplastic-Matrix Composite", Polym. Compos. 23(5),
697-701 (2002).
|
67. |
Zhen Mei, Victor H. Guerrero, Daniel P. Kowalik and D.D.L. Chung, "Mechanical Damage
and Strain in Carbon Fiber Thermoplastic-Matrix Composite, Sensed by Electrical Resistivity Measurement",
Polym. Compos. 23(3), 425-432 (2002).
|
68. |
Zhen Mei and D.D.L. Chung, "Thermoplastic Matrix Phase Transitions in a
Carbon Fiber Composite, Studied by Contact Electrical Resistivity Measurement of the Interface between Two
Unbonded Laminae", Polym. Compos. 23(5), 824-827 (2002).
|
69. |
Shoukai Wang, Daniel P. Kowalik and D.D.L. Chung, "Effects of the
Temperature, Humidity and Stress on the Interlaminar Interface of Carbon Fiber Polymer-Matrix Composites,
Studied by Contact Electrical Resistivity Measurement", J. Adh. 78, 189-200 (2002).
|
70. |
Shoukai Wang and D.D.L. Chung, "Effect of Moisture on the Interlaminar
Interface of a Carbon Fiber Polymer-Matrix Composite, Studied by Contact Electrical Resistivity
Measurement", Compos. Interfaces Lett. 9(5), 453-458 (2002).
|
71. |
Junhua Wu and D.D.L. Chung, "Decreasing the Electromagnetic Observability of
Carbon Fiber Polymer-Matrix Composites by Using Epoxy-Coated Carbon Fibers", Compos. Interfaces
Lett. 9(4), 389-393 (2002).
|
72. |
Victor H. Guerrero and D.D.L. Chung, "Enhancement of the Absolute
Thermoelectric Power of Carbon Fiber Polymer-Matrix Composite in the Through-Thickness Direction", Compos.
Interfaces Lett. 9(4), 395-401 (2002).
|
73. |
Victor H. Guerrero, Shoukai Wang, Sihai Wen and D.D.L. Chung, "Thermoelectric
Property Tailoring by Composite Engineering", J. Mater. Sci. 37(19), 4127-4136 (2002).
|
74. |
Victor H. Guerrero and D.D.L. Chung, "Interlaminar Interface Relaxation Upon
Heating Carbon Fiber Thermoplastic-Matrix Composite, Studied by Electrical Resistance Measurement", Compos.
Interfaces Lett. 9(6), 557-563 (2002).
|
75. |
D.D.L. Chung and Shoukai Wang, "Self-Sensing of Damage and Strain in Carbon
Fiber Polymer-Matrix Structural Composites by Electrical Resistance Measurement", Polym. & Polym.
Compos. 11(7), 515-525 (2003).
|
76. |
Adam Fosbury, Shoukai Wang, Yat F. Pin and D.D.L. Chung, "The Interlaminar
Interface of a Carbon Fiber Polymer-Matrix Composite as a Resistance Heating Element", Composites:
Part A, 34, 933-940 (2003).
|
77. |
Jun Xiao and D.D.L. Chung, "Thermal and Mechanical Stability of Electrical
Conductive Adhesive Joints", J. Electron. Mater. 34(5), 625-629 (2005).
|
78. |
Jun Xiao and D.D.L. Chung, "Electrothermomechanical
Analysis and Its Application to Studying Electrically Conductive Joints", J. Thermal Analysis
Calorimetry 74, 3-11 (2003).
|
79. |
Dwayne A. Gordon, Shoukai Wang and D.D.L. Chung, "Piezoresistivity in
Unidirectional Continuous Carbon Fiber Polymer-Matrix Composites: Single-Lamina Composite Versus Two-Lamina
Composite", Composite Interfaces 11(1), 95-103 (2004).
|
80. |
D.D.L. Chung, "Self-Heating
Structural Materials", Smart Mater. Struct. 13(3), 562-565 (2004).
|
81. |
Shoukai Wang, Daniel P. Kowalik and D.D.L. Chung, "Self-Sensing
Attained in Carbon Fiber Polymer-Matrix Structural Composites by Using the Interlaminar Interface as a
Sensor", Smart Mater. Struct. 13(3), 570-592 (2004).
|
82. |
Junhua Wu and D.D.L. Chung, "Calorimetric Study of the Effect of Carbon
Fillers on the Curing of Epoxy", Carbon 42(14), 3039-3042 (2004).
|
83. |
Shoukai Wang, D.D.L. Chung and Jaycee H. Chung, "Effects of Composite Lay-Up
Configuration and Thickness of the Damage Self-Sensing Behavior of Carbon Fiber Polymer-Matrix
Composite", J. Mater. Sci.40(2), 561-568.
|
84. |
Shoukai Wang and D.D.L. Chung, "The Interlaminar Interface of a Carbon Fiber
Epoxy-Matrix Composite as an Impact Sensor", J. Mater. Sci.40, 1863-1867 (2005).
|
85. |
Shoukai Wang, D.D.L. Chung and Jaycee Chung, "Impact
Damage of Carbon Fiber Polymer-Matrix Composites, Monitored by Electrical Resistance Measurement", Composites
Part A, 36, 1707-1715 (2005).
|
86. |
Shoukai Wang, D.D.L. Chung and Jaycee Chung, "Self-Sensing
of Damage in Carbon Fiber Polymer-Matrix Composite Cylinder by Electrical Resistance Measurement", J.
Intelligent Material Systems and Structures 17(1), 57-62 (2006).
|
87. |
Shoukai Wang, D.D.L. Chung and Jaycee Chung, "Self-Sensing
of Damage in Carbon Fiber Polymer-Matrix Composite by Measurement of the Electrical Resistance or Potential
Away from the Damaged Region", J. Mater. Sci. 40(24), 6463-6472 (2005).
|
88. |
Shoukai Wang and D.D.L. Chung, "Discussion on Paper 'The Electrical Resistance Response of Continuous
Carbon Fibre Composite Laminates to Mechanical Strain' by N. Angelidis, C.Y. Wei and P.E. Irving,
Composites: Part A 35, 1135-1147 (2004)", Composites: Part A, 37(9),1490-1494(2006).
|
89. |
Chia-Ken Leong, Shoukai Wang and D.D.L. Chung, "Effect of
Through-Thickness Compression on the Microstructure of Carbon Fiber Polymer-Matrix Composites, as Studied by
Electrical Resistance Measurement", J. Mater. Sci. 41(10), 2877-2884 (2006)
|
90. |
Daojun Wang, Shoukai Wang, D.D.L. Chung and Jaycee H. Chung, "Method of
Sensing Impact Damage in Carbon Fiber Polymer-Matrix Composite by Electrical Resistance Measurement",
J. Mater. Sci. 41(8), 2281-2289 (2006).
|
91. |
Daojun Wang, Shoukai Wang, D.D.L. Chung and Jaycee H. Chung, "Comparison of the Electrical Resistance and Potential Techniques for the
Self-Sensing of Damage in Carbon Fiber Polymer-Matrix Composites", J. Intel. Mater. Syst. Struct.
17,853-861(2006).
|
92. |
Daojun Wang, Shoukai Wang, D.D.L. Chung and Jaycee H. Chung, "Sensitivity of
the Two-Dimensional Electric Potential/Resistance Method for Damage Monitoring in Carbon Fiber
Polymer-Matrix Composite", J. Mater. Sci. 41(15), 4839-4846 (2006).
|
93. |
Zongrong Liu and D.D.L. Chung,
"Boron Nitride Particle Filled Paraffin Wax as a Phase-Change Thermal Interface Material", J.
Electron. Packaging 128(4), 319-323 (2006).
|
94. |
Yasuhiro Aoyagi, Chia-Ken Leong and D.D.L. Chung, "Polyol-Based
Phase-Change Thermal Interface Materials", J. Electron. Mater. 35(3), 416-424 (2006).
|
95. |
Shoukai Wang and D.D.L. Chung, "Self-Sensing of Flexural Strain and Damage in Carbon Fiber Polymer-Matrix
Composite by Electrical Resistance Measurement", Carbon 44(13), 2739-2751(2006).
|
96. |
Daojun Wang and D.D.L. Chung, "Comparative Evaluation of the Electrical Configurations for the
Two-Dimensional Electric Potential Method of Damage Monitoring in Carbon Fiber Polymer-Matrix Composite",
Smart Mater.Struct. 15, 1332-1344(2006).
|
97. |
Shoukai Wang and D.D.L. Chung, "Negative Piezoresistivity in
Continuous Carbon Fiber Epoxy-Matrix Composite", J. Mater. Sci. 42(13),
4987-4995 (2007).
|
98. |
Shoukai Wang, Dick S. Pang and D.D.L. Chung, "Hygrothermal Stability of
Electrical Contacts Made from Silver and Graphite Electrically Conductive Pastes", J. Electron.
Mater. 36(1), 65-74 (2007).
|
99. |
D.D.L. Chung, "Damage
Detection Using Self-Sensing Concepts", J. Aerospace Eng. (Proceedings of the Institution of
Mechanical Engineers, Part G) 221(G4), 509-520 (2007).
|
100. |
Yasuhiro Aoyagi and D.D.L. Chung, "Effects of Antioxidants and the Solid
Component on the Thermal Stability of Polyol-Ester-Based Thermal Pastes", J. Mater. Sci. 42(7),
2358-2375 (2007).
|
101. |
Sirong Zhu and D.D.L. Chung, "Analytical
Model of Piezoresistivity for Strain Sensing in Carbon Fiber Polymer-Matrix Structural Composite under
Flexure", Carbon 45(8), 1606-1613 (2007).
|
102. |
Daojun Wang and D.D.L. Chung, "Through-Thickness Stress Sensing of Carbon
Fiber Polymer-Matrix Composite by Electrical Resistance Measurement", Smart Mater. Struct. 16,
1320-1330 (2007).
|
103. |
Chuangang Lin and D.D.L. Chung, "Nanostructured Fumed Metal Oxides for Thermal Interface Pastes", J.
Mater. Sci. 42(22), 9245-9255 (2007).
|
104. |
Yasuhiro Aoyagi and D.D.L. Chung, "Antioxidant-based phase-change thermal interface materials with high
thermal stability", J. Electron. Mater. 37(4), 448-461 (2008).Published online: Jan. 25, 2008.
|
105. |
Junhua Wu and D.D.L. Chung, "Combined Use of Magnetic and Electrically
Conductive Fillers in a Polymer Matrix for Electromagnetic Interference Shielding", J. Electron.
Mater. Online First.
|
106. |
Chuangang Lin and D.D.L. Chung, "Nanoclay
Paste as Thermal Interface Material for Smooth Surfaces", J. Electron. Mater. 37(11), 1698-1709
(2008).
|
107. |
Parisa Pour Shahid Saeed Abadi, Chia-Ken Leong and D.D.L. Chung, "Factors that Govern the Performance of Thermal Interface Materials",
J.
Electron. Mater. 38(1), 175-192 (2009).
|
108. |
Chuangang Lin and D.D.L. Chung, "Rheological Behavior of
Thermal Interface Pastes", J. Electron. Mater. 38(10), 2069 (2009).
|
109. |
Parisa Pour Shahid Saeed Abadi and D.D.L. Chung, "Numerical
Modeling of the Performance of Thermal Interface
Materials in the Form of Paste-Coated Sheets", J. Electron. Mater. 40(7), 1490-1500 (2011).
|
110. |
Seungjin Han and D.D.L. Chung, “Increasing the Through-Thickness Thermal Conductivity of Carbon Fiber
Polymer-Matrix Composite by Curing Pressure Increase and Filler Incorporation”, Compos. Sci.
Technol. 71(16), 1944-1952 (2011).
|
111. |
Seungjin Han and D.D.L. Chung, “Mechanical Energy Dissipation Using Carbon Fiber Polymer-Matrix Structural
Composites with Filler Incorporation”, J. Mater. Sci. 47, 2434-2453 (2012). The final
publication is available at www.springerlink.com.
|
112. |
Seungjin Han and D.D.L. Chung, “Through-thickness thermoelectric power of a carbon fiber/epoxy composite
and decoupled contributions from a lamina and an interlaminar interface”, Carbon 52, 30-39
(2013).
|
113. |
Seungjin Han and D.D.L. Chung, "Carbon
fiber polymer-matrix structural composites exhibiting greatly enhanced through-thickness thermoelectric
figure of merit", Composites Part A 48, 162-170 (2013).
|
114. |
Daojun Wang and D.D.L. Chung, “
Through-Thickness Piezoresistivity in a Carbon Fiber Polymer-Matrix Structural Composite for
Electrical-Resistance-Based Through-Thickness Strain Sensing ”, Carbon 60(1), 129-138
(2013).
|
115. |
Seungjin Han and D.D.L. Chung, “
Strengthening and stiffening carbon fiber epoxy composites by halloysite nanotubes, carbon nanotubes and
silicon carbide whiskers ”, Applied Clay Science 83-84, 375-382 (2013).
|
116. |
Yoshihiro Takizawa and D.D.L. Chung, “
Through-thickness thermal conduction in glass fiber polymer-matrix composites and its enhancement by
composite modification ”, J. Mater. Sci . 51, 3463-3480 (2016).
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